Difficulty
Moderate
Steps
8
Time Required
20 minutes
Sections
2
- Rear Glass
- 3 steps
- Motherboard
- 5 steps
Flags
0
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Introduction
What you need
Step 1
Rear Glass
- Use a pair of iOpeners by heating them in a microwave and placing the hot pads on the edges of the phone.
- Allow to sit for 1-2 minutes to heat up the adhesive.
- A heat gun may need to be used if you have trouble separating the backing in the next step.
Use a pair of iOpeners by heating them in a microwave and placing the hot pads on the edges of the phone.
Allow to sit for 1-2 minutes to heat up the adhesive.
A heat gun may need to be used if you have trouble separating the backing in the next step.
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Step 2
- Insert an Opening Tool into the seam between the rear glass and side of the phone.
- Pry the glass off just enough to insert an Opening Pick.
- Slide the Opening Tool around the edges of the device, placing Opening Picks regularly.
Insert an Opening Tool into the seam between the rear glass and side of the phone.
Pry the glass off just enough to insert an Opening Pick.
Slide the Opening Tool around the edges of the device, placing Opening Picks regularly.
Step 3
- Once all edges of the device are lifted free, use a Suction Handle to gently pull the rear glass off the device.
Once all edges of the device are lifted free, use a Suction Handle to gently pull the rear glass off the device.
Step 4
Motherboard
- Remove the ten 4mm screws using the Phillips #00 Screwdriver.
Remove the ten 4mm screws using the Phillips #00 Screwdriver.
Step 5
- Gently push down on the small black tab with a Spudger to release the protective board.
- Slide an Opening Tool between the phone and the protective board and slide along the edges of the phone to unclip it.
- Carefully wiggle the board back and forth while gently pulling to unclip the last attachment point.
Gently push down on the small black tab with a Spudger to release the protective board.
Slide an Opening Tool between the phone and the protective board and slide along the edges of the phone to unclip it.
Carefully wiggle the board back and forth while gently pulling to unclip the last attachment point.
Step 6
- Slide an Opening Tool between the lower protective board and the phone to unclip.
- Slide the tool along the remaining edges of the protective board until it pops off.
Slide an Opening Tool between the lower protective board and the phone to unclip.
Slide the tool along the remaining edges of the protective board until it pops off.
Step 7
- Gently pry each visible ribbon cable away from the motherboard to disconnect them.
Gently pry each visible ribbon cable away from the motherboard to disconnect them.
Step 8
- Gently remove the motherboard from the phone.
Gently remove the motherboard from the phone.
To reassemble your device, follow these instructions in reverse order.
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Author
with 2 other contributors
Geoffrey Smith
Member since: 04/18/2019
368 Reputation
3 Guides authored
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Team
Cal Poly, Team S1-G3, Maness Spring 2019
Member of Cal Poly, Team S1-G3, Maness Spring 2019
CPSU-MANESS-S19S1G3
4 Members
10 Guides authored
Julian Marley - Jan 27, 2021
Reply
I followed these instructions and now my phone’s touchscreen is unresponsive. The phone turns off and on by holding the power button, and the screen displays the image properly, but it won’t respond to touch to unlock it.
